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LEADER 00000nam 2200000uu 4500
001    43660
003     ULIBM
008    150626s20119999eng 000 0 eng d
020    ^a9780470827802
050 14 ^aTK7870.15^bL58M
100 1  ^aLiu, Sheng
245 10 ^aModeling and simulation for microelectronic packagingassembly :^bmanufacturing,reliability and testing /^cSheng Liu, Yong Liu
260    ^aHoboken, N.J. :^bWiley,^c2011
300    ^axxii, 564 p. :^bill
504    ^aIncludes bibliographical references and index
650  0 ^aMicroelectronic packaging^xSimulation methods
700 1  ^aLiu, Yong
945    ^p3070^l0^i201500082
999     ^aRodjaney
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